for bonding materials in applications requiring uniform stress distribution and high tensile and shear strength · achieves fast bonds with a variety of materials, including metals, plastics and elastomers · also for bonding porous materials such as wood, paper, leather and textiles · for all quick repairs as well as small emergency repairs of all kinds · NSF P1 approval, Reg. No. 123011 · Temperature: -40 to +120°C · Approval: NSF P1
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