especially for bonding various rubber materials (e.g. solid rubber or foam rubber) and plastics · particularly suitable for bonding EPDM elastomers · low viscosity, 20-40 m Pa.s · very fast curing · temperature resistant from -50 °C to approx. +80 °C (short-term up to +100 °C) · ISEGA certificate of conformity as adhesive in the food industry Further technical properties:· Max. gap filling: 0.1mm· Approval: ISEGA
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